all specification & dimensions are subject to change, please cal l your nearest foxconn sales re presentative for update informat ion. 14 specifications vr 372 lga/bga power connector lga smt type 1.27x1.5mm [.05x.06?] pitch 372 pos. mechanical socket compression force: 165n min.,372n max. durability: 20 cycles min. solder ball shear force: 500g min. electrical contact resistance : 18 m ? max. insulation resistance: 800m ? min. dielectric withstanding voltage: 360v rms min. physical housing: thermoplastic, ul 94v-0 rated, black color cap: thermoplastic, ul 94v-0 rated, black color contact: copper alloy plating: see ?ordering information? operating temperature: -55 j to +110 j ordering in for mation grid array type 13=13x30 grid array cotacts plating 3=30u" au solder ball type 0=sn/pb actual loading contacts no. 0372=372 positions product no.:p e 0 3 7 2 0 3 - 1 3 6 1 - 2 1 material of contact 1=copper alloy with or without post 6=w/ post pick-up design 1=plastic pick-up cap package 2=tape&reel
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